Os motores de busca de Datasheet de Componentes eletrônicos |
|
FAN54014UCX(1) Folha de dados(PDF) 5 Page - Fairchild Semiconductor |
|
FAN54014UCX(1) Folha de dados(HTML) 5 Page - Fairchild Semiconductor |
5 / 36 page © 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5401X Family • Rev. 1.0.4 5 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VBUS VBUS Voltage Continuous –1.4 20.0 V Pulsed, 100 ms Maximum Non-Repetitive –2.0 VSTAT STAT Voltage –0.3 16.0 V VI PMID Voltage 7.0 V SW, CSIN, VBAT, AUXPWR, DISABLE Voltage –0.3 7.0 VO Voltage on Other Pins –0.3 6.5 (4) V dt dVBUS Maximum VBUS Slope above 5.5 V when Boost or Charger are Active 4 V/ s ESD Electrostatic Discharge Protection Level Human Body Model per JESD22-A114 2000 V Charged Device Model per JESD22-C101 500 TJ Junction Temperature –40 +150 °C TSTG Storage Temperature –65 +150 °C TL Lead Soldering Temperature, 10 Seconds +260 °C Note: 4. Lesser of 6.5 V or VI + 0.3 V. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol Parameter Min. Max. Unit VBUS Supply Voltage 4 6 V VBAT(MAX) Maximum Battery Voltage when Boost enabled 4.5 V dt dVBUS Negative VBUS Slew Rate during VBUS Short Circuit, CMID < 4.7 µF (see VBUS Short While Charging) TA < 60°C 4 V/ s TA > 60°C 2 TA Ambient Temperature –30 +85 °C TJ Junction Temperature (see Thermal Regulation and Protection section) –30 +120 °C Thermal Properties Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperature TA. For measured data, see Table 11. Symbol Parameter Typical Unit JA Junction-to-Ambient Thermal Resistance 60 °C/W JB Junction-to-PCB Thermal Resistance 20 °C/W |
Nº de peça semelhante - FAN54014UCX(1) |
|
|
Ligação URL |
Privacy Policy |
ALLDATASHEETPT.COM |
ALLDATASHEET é útil para você? [ DONATE ] |
Sobre Alldatasheet | Publicidade | Contato conosco | Privacy Policy | roca de Link | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |