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OP279GP Folha de dados(PDF) 3 Page - Analog Devices

Nome de Peças OP279GP
Descrição Electrónicos  Rail-to-Rail High Output Current Operational Amplifiers
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OP279GP Folha de dados(HTML) 3 Page - Analog Devices

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OP179/OP279
–3–
REV. F
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +16 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +16 V
Differential Input Voltage
1 . . . . . . . . . . . . . . . . . . . . . . . . .
±1 V
Output Short-Circuit Duration to GND . . . . . . . . . . Indefinite
Storage Temperature Range
P, S, RT, RU Package . . . . . . . . . . . . . . . . –65
°C to +150°C
Operating Temperature Range
OP179G/OP279G . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Junction Temperature Range
P, S, RT, RU Package . . . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300
°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the OP179/OP279 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ORDERING GUIDE
Package
Temperature Range
Package Description
Package Option
Brand Code
OP179GRT
–40
°C to +85°C
5-Lead SOT-23
RT-5
A2G
OP279GP
–40
°C to +85°C
8-Lead Plastic DIP
N-8
OP279GS
–40
°C to +85°C
8-Lead SOIC
SO-8
OP279GRU
–40
°C to +85°C
8-Lead TSSOP
RU-8
WARNING!
ESD SENSITIVE DEVICE
Package Types
JA
2
JC
Unit
5-Lead SOT-23 (RT)
256
81
°C/W
8-Lead Plastic DIP (P)
103
43
°C/W
8-Lead SOIC (S)
158
43
°C/W
8-Lead TSSOP (RU)
240
43
°C/W
NOTES
1The inputs are clamped with back-to-back diodes. If the differential input voltage
exceeds 1 volt, the input current should be limited to 5 mA.
2
θ
JA is specified for the worst case conditions, i.e.,
θ
JA is specified for device in socket
for P-DIP, packages;
θ
JA is specified for device soldered in circuit board for SOIC
packages.


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