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TMP12 Folha de dados(PDF) 4 Page - Analog Devices |
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TMP12 Folha de dados(HTML) 4 Page - Analog Devices |
4 / 14 page TMP12 REV. 0 –4– ABSOLUTE MAXIMUM RATINGS* Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 15 V Heater Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V Setpoint Input Voltage . . . . . . . . . . . 0.3 V to [(V ) 0.3 V] Reference Output Current . . . . . . . . . . . . . . . . . . . . . . . . 2 mA Open-Collector Output Current . . . . . . . . . . . . . . . . . . 50 mA Open-Collector Output Voltage . . . . . . . . . . . . . . . . . . . 15 V Operating Temperature Range . . . . . . . . . . 55 °C to 150°C Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . 175 °C Storage Temperature Range . . . . . . . . . . . . 65 °C to 160°C Lead Temperature(Soldering, 60 sec) . . . . . . . . . . . . . 300 °C Package Type Θ JA Θ JC Units 8-Pin Plastic DIP (P) 1031 43 °C/W 8-Lead SOIC (S) 1582 43 °C/W NOTES 1 ΘJA is specified for device in socket (worst case conditions). 2 ΘJA is specified for device mounted on PCB. CAUTION 1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to the above maximum rating conditions for extended periods may affect device reli- ability. 2. Digital inputs and outputs are protected, however, permanent damage may occur on unprotected units from high-energy electrostatic fields. Keep units in conductive foam or packaging at all times until ready to use. Use proper antistatic handling procedures. 3. Remove power before inserting or removing units from their sockets. ORDERING GUIDE Temperature Package Package Model/Grade Range 1 Description Option TMP12FP XIND Plastic DIP N-8 TMP12FS XIND SOIC SO-8 TMP12GBC 25 °C Die NOTE 1XIND = 40 °C to 125°C FUNCTIONAL DESCRIPTION The TMP12 incorporates a heating element, temperature sen- sor, and two user-selectable setpoint comparators on a single substrate. By generating a known amount of heat, and using the setpoint comparators to monitor the resulting temperature rise, the TMP12 can indirectly monitor the performance of a system’s cooling fan. The TMP12 temperature sensor section consists of a bandgap voltage reference which provides both a constant 2.5 V output and a voltage which is proportional to absolute temperature (VPTAT). The VPTAT has a precise temperature coefficient of 5 mV/K and is 1.49 V (nominal) at 25 °C. The comparators compare VPTAT with the externally set temperature trip points and generate an open-collector output signal when one of their respective thresholds has been exceeded. The heat source for the TMP12 is an on-chip 100 Ω low tempco thin-film resistor. When connected to a 5 V source, this resistor dissipates: PD = V2 R 52 V 100 Ω = 0.25 W , = which generates a temperature rise of about 32 °C in still air for the SO packaged device. With an airflow of 450 feet per minute (FPM), the temperature rise is about 22 °C. By selecting a temp- erature setpoint between these two values, the TMP12 can provide a logic-level indication of problems in the cooling system. A proprietary, low tempco thin-film resistor process, in conjunc- tion with production laser trimming, enables the TMP12 to provide a temperature accuracy of 3 °C (typ) over the rated temperature range. The open-collector outputs are capable of sinking 20 mA, allowing the TMP12 to drive small control re- lays directly. Operating from a single 5 V supply, the quiescent current is only 600 µA (max), without the heater resistor current. |
Nº de peça semelhante - TMP12 |
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Descrição semelhante - TMP12 |
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