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X00619MA1AA2 Folha de dados(PDF) 3 Page - STMicroelectronics |
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3 / 10 page X00619 Characteristics Doc ID 15755 Rev 2 3/10 Table 5. Thermal resistances Symbol Parameter Value Unit Rth(j-l) Junction to leads (DC) TO-92 Max. 70 °C/W Rth(j-c) Junction to case (DC) SOT-223 30 Rth(j-a) Junction to ambient (DC) TO-92 150 S = 5 cm2 SOT-223 60 Figure 1. Maximum average power dissipation versus average on-state current Figure 2. Average and DC on-state current versus case temperature (SOT-223) P(W) 0.0 0.2 0.4 0.6 0.0 0.1 0.2 0.3 0.4 0.5 0.6 °° ° ° °DC I (A) T(AV) 360° α α = 30°, 60°, 90°, 120°, 180°, DC I (A) T(AV) 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 SOT-223 T (°C) l α = 30°, 60°, 90°, 120°, 180°, DC Figure 3. Average and DC on-state current versus lead temperature (TO-92) Figure 4. Average and DC on-state current versus ambient temperature (free air convection) I (A) T(AV) 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 TO-92 T (°C) l α = 30°, 60°, 90°, 120°, 180°, DC I (A) T(AV) 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 TO-92 SCU= 0.5 cm² T (°C) amb α = 180° DC SOT-223 SCU= 5 cm² |
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