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TS19601CP5RO Folha de dados(PDF) 6 Page - Taiwan Semiconductor Company, Ltd

Nome de Peças TS19601CP5RO
Descrição Electrónicos  700mA High Voltage Adjustable Current Regulator With Enable Control
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Fabricante Electrônico  TSC [Taiwan Semiconductor Company, Ltd]
Página de início  http://www.taiwansemi.com
Logo TSC - Taiwan Semiconductor Company, Ltd

TS19601CP5RO Folha de dados(HTML) 6 Page - Taiwan Semiconductor Company, Ltd

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TS19601
700mA High Voltage Adjustable Current Regulator
With Enable Control
6/8
Version: B11
Thermal Consideration Information
The Maximum Power Dissipation on Current Regulator
PD(MAX) = VOUT(MAX) × IOUT(NOM) + VIN(MAX) × IDD
VOUT(MAX) = the maximum voltage on output pin;
IOUT(NOM) = the nominal output current;
IDD = the quiescent current the regulator consumes at IOUT(NOM);
VIN(MAX) = the maximum input voltage.
Thermal Consideration
The TS19601 has internal power and thermal limiting circuitry designed to protect the device under overload
conditions. However, maximum junction temperature ratings should not be exceeded under continuous normal load
conditions. The thermal protection circuit of TS19601 prevents the device from damage due to excessive power
dissipation. When the device junction temperature rises to approximately 150°C, the regulator will be turned off.
When power consumption is over about 1000mW (TO-252 package, at TA=70°C), additional heat sink is required to
control the junction temperature below 125°C.
The junction temperature is:
TJ = PD JT CS SA ) + TA
PD : Dissipated power.
θ
JT: Thermal resistance from the junction to the mounting tab of the package.
For TO-252 package, θJT = 7.0°C/W.
θ
CS: Thermal resistance through the interface between the IC and the surface on which it is mounted.
(typically, θCS < 1.0°C /W)
θ
SA: Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of
copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected
with
several through-hole vias.
PCB θJA ºC/W
59
45
38
33
27
24
21
PCB heat sink size
500
1000
1500
2000
3000
4000
5000


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