FDN335N Rev. C

Figure 11. Transient Thermal Response Curve.

Thermal characterization performed using the conditions described in Note 1b.

Transient themal response will change depending on the circuit board design.

0.0001

0.001

0.01

0.1

1

10

100

300

0.001

0.002

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1

t , TIME (sec)

R

(t) = r(t) * R

R

= 270 °C/W

Duty Cycle, D = t /t

1

2

θJA

θJA

θJA

T - T

= P * R

(t)

A

J

P(pk)

1

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

0

4

8

12

16

20

0.0001

0.001

0.01

0.1

1

10

100

1000

SINGLE PULSE TIME (SEC)

SINGLE PULSE

o

C/W

o

C

0.01

0.1

1

10

0.1

1

10

100

DC

10s

1s

100ms

10ms

1ms

SINGLE PULSE

0

1

2

3

4

5

00.5

11.5

22.5

33.5

4

10V

15V

0

100

200

300

400

500

0

4

8

12

16

20

f = 1MHz

Figure 7. Gate Charge Characteristics.

Figure 8. Capacitance Characteristics.

Figure 9. Maximum Safe Operating Area.

Figure 10. Single Pulse Maximum

Power Dissipation.