SM30TY

Characteristics

Doc ID 022065 Rev 2

5/13

Figure 11.

Thermal resistance junction to ambient versus copper surface under each lead

Figure 9.

Peak forward voltage drop versus

peak forward current

(typical values)

Figure 10.

Relative variation of thermal

impedance, junction to ambient,

versus pulse duration

I

(A)

FM

0.1

1.0

10.0

100.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

T = 150 °C

j

T = 25 °C

j

V

(V)

FM

Z/R

th(j-a)

th(j-a)

0.01

0.10

1.00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Recommended pad layout

Single pulse

t (s)

p

epoxy printed board, FR4 copper thickness = 35 µm

0

10

20

30

40

50

60

70

80

90

100

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S (cm )

Cu

2

epoxy printed board, FR4 copper thickness = 35 µm