5

AbsoluteMaximumRatings

Parameter

Symbol

Min.

Max.

Units

Note

Storage Temperature

-55

125

°C

Junction Temperature

-40

125

°C

Average Input Current

25

mA

1

Peak Transient Input Current

1.0

A

(<1 µs pulse width, 300 pps)

Reverse Input Voltage

5

V

“High” Peak Output Current

2.5

A

2

“Low” Peak Output Current

2.5

A

2

Supply Voltage

-0.5

25

V

Output Voltage

0

V

Output Power Dissipation

250

mW

3

Total Power Dissipation

295

mW

4

Lead Solder Temperature

260°C for 10 sec., 1.6 mm below seating plane

Solder Reflow Temperature Profile

See Package Outline Drawings section

0

0

TS – CASE TEMPERATURE – °C

200

600

400

25

800

50

75 100

200

150 175

PS (mW)

125

100

300

500

700

IS (mA)

InsulationandSafetyRelatedSpecifications

Parameter

Symbol

HCPL-3180

Units

Conditions

Minimum External Air Gap

L(101)

7.1

mm

Measured from input terminals to output

(Clearance)

terminals, shortest distance through air.

Minimum External Tracking

L(102)

7.4

mm

Measured from input terminals to output

(Creepage)

terminals, shortest distance path along body.

Minimum Internal Plastic Gap

0.08

mm

Through insulation distance conductor to

(Internal Clearance)

conductor, usually the straight line distance

thickness between the emitter and detector.

Tracking Resistance

CTI

>175

V

DIN IEC 112/VDE 0303 Part 1

(Comparative Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Note: Option 300 – surface mount classification is Class A in accordance with CECC 00802.