LM137, LM337-N

SNVS778D – MAY 1999 – REVISED APRIL 2013

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APPLICATION HINTS

When a value for

less than or equal to this number.

HEATSINKING SOT-223 PACKAGE PARTS

The SOT-223 (“DCY”) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize

the heat sinking ability of the plane and PCB, solder the tab of the package to the plane.

Figure 9 and Figure 10 show the information for the SOT-223 package. Figure 10 assumes a

1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C.

Figure 9.

Please see AN-1028 (literature number SNVA036) for power enhancement techniques to be used with the SOT-

223 package.

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