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LM337H Folha de dados(PDF) 8 Page - Texas Instruments |
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LM337H Folha de dados(HTML) 8 Page - Texas Instruments |
8 / 22 page LM137, LM337-N SNVS778D – MAY 1999 – REVISED APRIL 2013 www.ti.com APPLICATION HINTS When a value for θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is less than or equal to this number. HEATSINKING SOT-223 PACKAGE PARTS The SOT-223 (“DCY”) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane. Figure 9 and Figure 10 show the information for the SOT-223 package. Figure 10 assumes a θ(J−A) of 75°C/W for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C. Figure 9. θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package Figure 10. Maximum Power Dissipation vs. TAMB for the SOT-223 Package Please see AN-1028 (literature number SNVA036) for power enhancement techniques to be used with the SOT- 223 package. 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM137 LM337-N |
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