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DAC1220E Folha de dados(PDF) 2 Page - Texas Instruments |
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DAC1220E Folha de dados(HTML) 2 Page - Texas Instruments |
2 / 26 page DAC1220 SBAS082G – FEBRUARY 1998 – REVISED SEPTEMBER 2009...................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). DAC1220 UNIT AVDD to DVDD ±0.3 V AVDD to AGND –0.3 to +6 V DVDD to DGND –0.3 to +6 V AGND to DGND ±0.3 V VREF voltage to AGND +2.0 to +3.0 V Digital input voltage to DGND –0.3 to DVDD + 0.3 V Digital output voltage to DGND –0.3 to DVDD + 0.3 V Package power dissipation (TJmax – TA) / θ JA W Maximum junction temperature (TJmax) +150 °C Thermal resistance, θ JA SSOP-16 200 °C/W Lead temperature (soldering, 10s) +300 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 2 Submit Documentation Feedback Copyright © 1998–2009, Texas Instruments Incorporated Product Folder Link(s): DAC1220 |
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