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BD00C0AWFPS-M Folha de dados(PDF) 9 Page - Rohm |
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BD00C0AWFPS-M Folha de dados(HTML) 9 Page - Rohm |
9 / 20 page Datasheet Datasheet 9/17 TSZ02201-0T2T0AN00050-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 08.Feb.2013 Rev.001 www.rohm.com TSZ22111・15・001 BD00C0AWFPS-M 0 1 2 3 4 5 0 255075 100 125 150 Ambient Temperature: Ta( ℃) 1.30 ●Power Dissipation Mounted on a Rohm standard board Board size : 70mm×70mm×1.6mm Copper foil area :7mm×7mm TO252S-5 θja=96.2(℃/W) IC mounted on a ROHM standard board Board size:70mm×70mm×1.6mm Copper area:7mm×7mm ①:2-layer PCB (Copper foil area on the reverse side of PCB:15mm×15mm) ②:2-layer PCB (Copper foil area on the reverse side of PCB:70mm×70mm) ③:4-layer PCB (Copper foil on the reverse side of PCB:70mm×70mm) ①: θja=67.6℃/W ②: θja=35.7℃/W ③: θja=26.0℃/W 0 1 2 3 4 5 0 255075 100 125 150 Ambient Temperature: Ta( ℃) ①1.85 ②3.50 ③4.80 Figure 19. Figure 20. TO252S-5 TO252S-5 |
Nº de peça semelhante - BD00C0AWFPS-M |
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Descrição semelhante - BD00C0AWFPS-M |
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