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5-104895-6 Folha de dados(PDF) 7 Page - Tyco Electronics |
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5-104895-6 Folha de dados(HTML) 7 Page - Tyco Electronics |
7 / 13 page 94 Catalog 889092 Dimensions are in millimeters Dimensions are shown for USA: 1-800-522-6752 South America: 55-11-3611-1514 Revised 9-06 and inches unless otherwise reference purposes only. Canada: 1-905-470-4425 Hong Kong: 852-2735-1628 specified. Values in brackets Specifications subject Mexico: 01-800-733-8926 Japan: 81-44-844-8013 www.tycoelectronics.com are standard equivalents. to change. C. America: 52-55-5-729-0425 UK: 44-141-810-8967 Fine Pitch SMT Stacking Connectors (Parallel Board-to-Board) Board-to-Board Right Angle Headers AMPMODU 50/50 Grid Right Angle Headers will accommodate a variety of high density packaging applications; right angle board-to-board applications when mated with vertical receptacles (page 91) and right angle cable-to-board applications when mated with cable connectors (page 97). The small 1.27 x 1.27 [.050 x .050] centerline contact spacing allows efficient use of the PC board area. Mechanical support of the headers to the PC board is provided by non-protrusive metallic holddowns designed for 1.57 [.062] or thicker PC boards. These holddowns are of the same design as those used in the vertical headers (page 92) and receptacles (page 91). There are also metallic tabs that are soldered to the sur- faces of the PC board pads for added support. AMPMODU 50/50 Grid Right Angle Headers are available in dual-row, in either latching or non- latching versions, and in sizes ranging from 10 through 100 positions (in 10 position increments). The latching version pro- vides positive retention when mated with the latch- ing cable connector (page 97). All headers feature polarization to help prevent misalignment during mating. Product Facts ■ Surface-mount products for right angle board-to-board and cable-to-board applications ■ Dual-row, right angle shrouded headers ■ High density 1.27 x 1.27 [.050 x .050] centerline grid ■ Latching and non-latching versions available ■ Non-protrusive metallic holddowns ■ Metallic tabs, when soldered to PC board pad, provide added mechanical support ■ Duplex plated post contacts; gold plated on mating area, tin plated on tails ■ Compatible with standard surface-mount processing (VPR and IR) ■ Standoffs on header housings allow for drainage of processing fluids ■ All headers are polarized ■ Sizes of 10, 20, 30, 40, 50, 60, 70, 80 and 100 positions ■ Recognized under the Component Program of Underwriters Laboratories Inc., File No. E28476 ■ Certified by Canadian Standards Association File No. LR7189 R R See Catalog 1307819 for additional AMPMODU product offerings. |
Nº de peça semelhante - 5-104895-6 |
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Descrição semelhante - 5-104895-6 |
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