10

Absolute Maximum Ratings

Parameter

Symbol

Min.

Max.

Units

Note

Storage Temperature

T

S

-55

125

°C

Operating Temperature

T

A

-40

85

°C

Average Forward Input Current

I

F(AVG)

10

mA

1

Peak Transient Input Current

(≤ 1 µs Pulse Width, 300 pps)

I

F(TRAN)

1.0

A

1

(≤ 200 µs Pulse Width,

HCNW22XX

40

mA

< 1% Duty Cycle)

Reverse Input Voltage

V

R

5

V

1

HCNW22XX

3

Average Output Current

I

O

25

mA

1

Supply Voltage

V

CC

0

20

V

Output Voltage

V

O

-0.5

20

V

1

Total Package Power Dissipation

P

T

210

mW

2

HCPL-223X

294

Output Power Dissipation

P

O

See Figure 7

1

Lead Solder Temperature (Through Hole Parts Only)

260°C for 10 sec.,

1.6 mm below seating plane

HCNW22XX

260°C for 10 sec., up to seating plane

Solder Reflow Temperature Profile

See Package Outline Drawings section

(Surface Mount Parts Only)

Recommended Operating Conditions

Parameter

Symbol

Min.

Max.

Units

Power Supply Voltage

V

CC

4.5

20

V

Forward Input Current (ON)

I

F(ON)

1.6*

5

mA

HCPL-223X

1.8†

Forward Input Voltage (OFF)

V

F(OFF)

-

0.8

V

Operating Temperature

T

A

-40

85

°C

Junction Temperature

T

J

-40

125

°C

Fan Out

N

4

TTL Loads

*The initial switching threshold is 1.6 mA or less. It is recommended that 2.2 mA be used to permit at least a 20% LED degradation guardband.

†The initial switching threshold is 1.8 mA or less. It is recommended that 2.5 mA be used to permit at least a 20% LED degradation guardband.