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TPA3106D1EVM Folha de dados(PDF) 2 Page - Texas Instruments

Nome de Peças TPA3106D1EVM
Descrição Electrónicos  40-W MONO CLASS-D AUDIO POWER AMPLIFIER
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Página de início  http://www.ti.com
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TPA3106D1
SLOS516C – OCTOBER 2007 – REVISED AUGUST 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
VCC
Supply voltage
AVCC, PVCC
–0.3 V to 30 V
SHUTDOWN, MUTE
–0.3 V to VCC + 0.3 V
VI
Input voltage
GAIN0, GAIN1, INN, INP, MSTR/SLV, SYNC
–0.3 V to VREG + 0.5 V
Continuous total power dissipation
See Thermal Information Table
TA
Operating free-air temperature range
–40°C to 85°C
TJ
Operating junction temperature range(2)
–40°C to 150°C
Tstg
Storage temperature range
–65°C to 150°C
RLoad
Load resistance
3.2
Ω Minimum
Human body model (3) (all pins)
±2 kV
Electrostatic discharge
Charged-device model (4) (all pins)
±500 V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The TPA3106D1 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected
to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection
shutdown. See TI Technical Briefs SCBA017D and SLUA271 for more information about using the QFN thermal pad. See TI Technical
Briefs SLMA002 for more information about using the HTQFP thermal pad.
(3)
In accordance with JEDEC Standard 22, Test Method A114-B.
(4)
In accordance with JEDEC Standard 22, Test Method C101-A
THERMAL INFORMATION
TPA3106D1
THERMAL METRIC(1) (2)
UNITS
VFP (32 PINS)
qJA
Junction-to-ambient thermal resistance
28.23
qJCtop
Junction-to-case (top) thermal resistance
32.4
qJB
Junction-to-board thermal resistance
16.6
°C/W
yJT
Junction-to-top characterization parameter
1
yJB
Junction-to-board characterization parameter
6.7
qJCbot
Junction-to-case (bottom) thermal resistance
1.1
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
VCC
Supply voltage
PVCC, AVCC
10
26
V
VIH
High-level input voltage
SHUTDOWN, MUTE, GAIN0, GAIN1, MSTR/SLV, SYNC
2
V
VIL
Low-level input voltage
SHUTDOWN, MUTE, GAIN0, GAIN1, MSTR/SLV, SYNC
0.8
V
SHUTDOWN, VI = VCC, VCC = 24 V
125
IIH
High-level input current
MUTE, VI = VCC, VCC = 24 V
75
µA
GAIN0, GAIN1, MSTR/SLV, SYNC, VI = VREG, VCC = 24 V
2
SHUTDOWN, VI = 0, VCC = 24 V
2
IIL
Low-level input current
µA
SYNC, MUTE, GAIN0, GAIN1, MSTR/SLV, VI = 0 V, VCC = 24 V
1
VOH
High-level output voltage
FAULT, IOH = 1 mA
VREG – 0.6
V
VOL
Low-level output voltage
FAULT, IOL = -1 mA
AGND + 0.4
V
fOSC
Oscillator frequency
ROSC resistor = 100 kΩ
200
300
kHz
2
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Product Folder Link(s): TPA3106D1


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