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BC847BWDG Folha de dados(PDF) 5 Page - NXP Semiconductors

Nome de Peças BC847BWDG
Descrição Electrónicos  45 V, 100 mA NPN general-purpose transistors
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Fabricante Electrônico  NXP [NXP Semiconductors]
Página de início  http://www.nxp.com
Logo NXP - NXP Semiconductors

BC847BWDG Folha de dados(HTML) 5 Page - NXP Semiconductors

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BC847_BC547_SER_7
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 07 — 10 December 2008
5 of 15
NXP Semiconductors
BC847/BC547 series
45 V, 100 mA NPN general-purpose transistors
5.
Limiting values
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Reflow soldering is the only recommended soldering method.
[3]
Device mounted on an FR4 PCB with 60
µm copper strip line, standard footprint.
6.
Thermal characteristics
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Reflow soldering is the only recommended soldering method.
[3]
Device mounted on an FR4 PCB with 60
µm copper strip line, standard footprint.
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCBO
collector-base voltage
open emitter
-
50
V
VCEO
collector-emitter voltage
open base
-
45
V
VEBO
emitter-base voltage
open collector
-
6
V
IC
collector current
-
100
mA
ICM
peak collector current
single pulse;
tp ≤ 1ms
-
200
mA
IBM
peak base current
single pulse;
tp ≤ 1ms
-
100
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
SOT23
[1] -
250
mW
SOT323
[1] -
200
mW
SOT416
[1] -
150
mW
SOT883
[2][3] -
250
mW
SOT54
[1] -
500
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
SOT23
[1] -
-
500
K/W
SOT323
[1] -
-
625
K/W
SOT416
[1] -
-
833
K/W
SOT883
[2][3] -
-
500
K/W
SOT54
[1] -
-
250
K/W


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