ADC083000 datasheet(11/48 Pages) TI

Nome de Peças	ADC083000

Descrição Electrónicos	ADC083000 8-Bit, 3 GSPS, High Performance, Low Power A/D Converter

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Fabricante Electrônico	TI [Texas Instruments]

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ADC083000

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SNAS358N – JUNE 2006 – REVISED JULY 2009

CONVERTER ELECTRICAL CHARACTERISTICS (continued)

The following specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential

820mVP-P, CL = 10 pF, Differential a.c. coupled Sinewave Input Clock, fCLK = 1.5GHz at 0.5VP-P with 50% duty cycle, VBG =

Floating, Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ±0.1%, Analog Signal Source Impedance = 100Ω

Differential, after calibration. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted.

(1)(2)

Units

Symbol

Parameter

Conditions

Typical(3)

Limits (3)

(Limits)

VCMO −

50

mV (min)

VCMI

Analog Input Common Mode Voltage

VCMO

VCMO +

mV (max)

50

Differential

0.08

pF

CIN

Analog Input Capacitance (5)(6)

Each input pin to ground

2.2

pF

95

Ω (min)

RIN

Differential Input Resistance

100

105

Ω (max)

ANALOG OUTPUT CHARACTERISTICS

0.95

V (min)

VCMO

Common Mode Output Voltage

ICMO = ±100 µA

1.26

1.45

V (max)

VA = 1.8V

0.60

V

VCMO input threshold to set DC Coupling

VCMO_LVL

mode

VA = 2.0V

0.66

V

Common Mode Output Voltage Temperature

TC VCMO

TA = −40°C to +85°C

118

ppm/°C

Coefficient

CLOAD VCMO

Maximum VCMO load Capacitance

80

pF

1.20

V (min)

VBG

Bandgap Reference Output Voltage

IBG = ±100 µA

1.26

1.33

V (max)

Bandgap Reference Voltage Temperature

TA = −40°C to +85°C,

TC VBG

28

ppm/°C

Coefficient

IBG = ±100 µA

Maximum Bandgap Reference load

CLOAD VBG

80

pF

Capacitance

TEMPERATURE DIODE CHARACTERISTICS

192 µA vs. 12 µA,

71.23

mV

TJ = 25°C

ΔVBE

Temperature Diode Voltage

192 µA vs. 12 µA,

85.54

mV

TJ = 85°C

LVDS INPUT CHARACTERISTICS

0.4

VP-P (min)

Sine Wave Clock

0.6

2.0

VP-P (max)

VID

Differential Clock Input Level

0.4

VP-P (min)

Square Wave Clock

0.6

2.0

VP-P (max)

II

Input Current

VIN = 0 or VIN = VA

±1

µA

Differential

0.02

pF

CIN

Input Capacitance (7)(8)

Each input to ground

1.5

pF

(5)

The analog and clock input capacitances are die capacitances only. Additional package capacitances of 0.65 pF differential and 0.95 pF

each pin to ground are isolated from the die capacitances by lead and bond wire inductances.

(6)

This parameter is specified by design and is not tested in production.

(7)

The analog and clock input capacitances are die capacitances only. Additional package capacitances of 0.65 pF differential and 0.95 pF

each pin to ground are isolated from the die capacitances by lead and bond wire inductances.

(8)

This parameter is specified by design and is not tested in production.

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