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TLC1079IDG4 Folha de dados(PDF) 3 Page - Texas Instruments |
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TLC1079IDG4 Folha de dados(HTML) 3 Page - Texas Instruments |
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3 / 36 page  TLC1078, TLC1078Y, TLC1079, TLC1079Y LinCMOS µPOWER PRECISION OPERATIONAL AMPLIFIERS SLOS179A – FEBRUARY 1997 – REVISED MARCH 2001 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC1087Y chip information This chip, when properly assembled, displays characteristics similar to the TLC1078C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips can be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. + – 1OUT 1IN + 1IN – VDD VDD – /GND (8) (3) (2) (4) + – 2OUT 2IN + 2IN – (5) (6) 83 72 (1) (5) (4) (3) (2) (6) (7) (8) BONDING PAD ASSIGNMENTS |
Nº de peça semelhante - TLC1079IDG4 |
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Descrição semelhante - TLC1079IDG4 |
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