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AD7945BR Folha de dados(PDF) 7 Page - Analog Devices

Nome de Peças AD7945BR
Descrição Electrónicos  3.3 V/5 V Multiplying 12-Bit DACs
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Fabricante Electrônico  AD [Analog Devices]
Página de início  http://www.analog.com
Logo AD - Analog Devices

AD7945BR Folha de dados(HTML) 7 Page - Analog Devices

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AD7943/AD7945/AD7948
REV. B
–7–
ORDERING GUIDE
Temperature
Linearity
Nominal
Package
Model
Range
Error (LSBs)
Supply Voltage
Option
1
AD7943BN
–40
°C to +85°C
±0.5
+5 V
N-16
AD7943BR
–40
°C to +85°C
±0.5
+5 V
R-16
AD7943BRS
–40
°C to +85°C
±0.5
+5 V
RS-20
AD7943AN-B
–40
°C to +85°C
±1
+3.3 V to +5 V
N-16
AD7943ARS-B
–40
°C to +85°C
±1
+3.3 V to +5 V
RS-20
AD7945BN
–40
°C to +85°C
±0.5
+5 V
N-20
AD7945BR
–40
°C to +85°C
±0.5
+5 V
R-20
AD7945BRS
–40
°C to +85°C
±0.5
+5 V
RS-20
AD7945AN-B
–40
°C to +85°C
±1
+3.3 V to +5 V
N-20
AD7945ARS-B
–40
°C to +85°C
±1
+3.3 V to +5 V
RS-20
AD7945TQ
–55
°C to +125°C
±1
+5 V
Q-20
AD7948BN
–40
°C to +85°C
±0.5
+5 V
N-20
AD7948BR
–40
°C to +85°C
±0.5
+5 V
R-20
AD7948BRS
–40
°C to +85°C
±0.5
+5 V
RS-20
AD7948AN-B
–40
°C to +85°C
±1
+3.3 V to +5 V
N-20
AD7948ARS-B
–40
°C to +85°C
±1
+3.3 V to +5 V
RS-20
NOTE
1N = Plastic DIP; R = SOP (Small Outline Package); RS = SSOP (Shrink Small Outline Package); Q = Cerdip.
ABSOLUTE MAXIMUM RATINGS
1
(TA = +25
°C unless otherwise noted)
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +6 V
IOUT1 to DGND . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
IOUT2 to DGND . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND . . . . . . –0.3 V to VDD + 0.3 V
VRFB, VREF to DGND . . . . . . . . . . . . . . . . . . . . . . . . . .
±15 V
Input Current to Any Pin Except Supplies
2
. . . . . . . .
±10 mA
Operating Temperature Range
Industrial (A, B Versions) . . . . . . . . . . . . . –40
°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . –55
°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
DIP Package, Power Dissipation . . . . . . . . . . . . . . . . 670 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 116
°C/W
Lead Temperature, Soldering, (10 sec) . . . . . . . . . . +260
°C
SOP Package, Power Dissipation . . . . . . . . . . . . . . . . . 450 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . . 875 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 132
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied.
Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Transient currents of up to 100 mA will not cause SCR latch-up.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7943/AD7945/AD7948 feature proprietary ESD protection circuitry, perma-
nent damage may occur on devices subjected to high energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE


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