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AD7741YR Folha de dados(PDF) 4 Page - Analog Devices

Nome de Peças AD7741YR
Descrição Electrónicos  Single and Multichannel, Synchronous Voltage-to-Frequency Converters
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REV. 0
AD7741/AD7742
–4–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7741/AD7742 features proprietary ESD protection circuitry, permanent dam-
age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
TIMING CHARACTERISTICS
1, 2, 3
Limit at TMIN, TMAX
Parameter
(B and Y Version)
Units
Conditions/Comments
fCLKIN
6.144
MHz max
tHIGH/tLOW
55/45
max
Input Clock Mark/Space Ratio
45/55
min
t1
9
ns typ
fCLOCK Rising Edge to fOUT Rising Edge
t2
4
ns typ
fOUT Rise Time
t3
4
ns typ
fOUT Fall Time
t4
tHIGH ± 5
ns typ
fOUT Pulsewidth
NOTES
1Guaranteed by design and characterization, not production tested.
2All input signals are specified with tr = tf = 5 ns (10% to 90% of V
DD) and timed from a voltage level of (V IL + VIH)/2.
3See Figure 1.
Specifications subject to change without notice.
(VDD = +4.75 V to +5.25 V; VREF = +2.5 V. All specifications TMIN to TMAX unless otherwise noted.)
ABSOLUTE MAXIMUM RATINGS
1, 2
(TA = +25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Input Voltage to GND . . . . . . . . –5 V to VDD + 0.3 V
Digital Input Voltage to GND . . . . . . . –0.3 V to VDD + 0.3 V
Reference Input Voltage to GND . . . . –0.3 V to VDD + 0.3 V
fOUT to GND . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Automotive (Y Version) . . . . . . . . . . . . . . –40
°C to +105°C
Industrial (B Version) . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Plastic DIP Package
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW
θ
JA Thermal Impedance (8 Lead) . . . . . . . . . . . . .
125
°C/W
θ
JA Thermal Impedance (16 Lead) . . . . . . . . . . . .
117
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
SOIC Package
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW
θ
JA Thermal Impedance (8 Lead) . . . . . . . . . . . . .
157
°C/W
θ
JA Thermal Impedance (16 Lead) . . . . . . . . . . . .
125
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Transient currents of up to 100 mA will not cause SCR latch-up.
ORDERING GUIDE
Temperature
Package
Package
Models
Ranges
Descriptions
Options
AD7741BN
–40
°C to +85°C
Plastic DIP
N-8
AD7741BR
–40
°C to +85°C
Small Outline
R-8
AD7741YR
–40
°C to +105°C
Small Outline
R-8
AD7742BN
–40
°C to +85°C
Plastic DIP
N-16
AD7742BR
–40
°C to +85°C
Small Outline
R-16A
AD7742YR
–40
°C to +105°C
Small Outline
R-16A
CLKIN
fOUT
tHIGH
t4
t1
t2
t3
Figure 1. Timing Diagram


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