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TS68C429ADESCXX Folha de dados(PDF) 9 Page - ATMEL Corporation

Nome de Peças TS68C429ADESCXX
Descrição Electrónicos  CMOS ARINC 429 Multichannel Receiver/ Transmitter MRT
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Fabricante Electrônico  ATMEL [ATMEL Corporation]
Página de início  http://www.atmel.com
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TS68C429A
2120A–HIREL–08/02
Power Considerations
The average chip-junction temperature, T
J, in °C can be obtained from:
T
J = TA + (PD ⋅ θJA)(1)
T
A = Ambient Temperature, °C
θ
JA = Package Thermal Resistance, Junction-to-Ambient, °C/W
P
D = PINT + PI/O
P
INT = ICC x VCC, Watts—Chip Internal Power
P
I/O = Power Dissipation on Input and Output Pins—User Determined
For most applications P
I/O < PINT and can be neglected.
An approximate relationship between P
D and TJ (if PI/O is neglected) is:
P
D = K: (TJ + 273)
(2)
Solving equations (1) and (2) for K gives:
K = P
D ⋅ (TA + 273) + θJA ⋅ PD
2
(3)
where K is a constant pertaining to the particular part K can be determined from equa-
tion (3) by measuring P
D (at equilibrium) for a known TA. Using this value of K, the
values of P
D and TJ can be obtained by solving equations (1) and (2) iteratively for any
value of T
A.
The total thermal resistance of a package (
θ
JA) can be separated into two components,
θ
JC and θCA, representing the barrier to heat flow from the semiconductor junction to the
package (case), surface (
θ
JC) and from the case to the outside ambient (θCA). These
terms are related by the equation:
θ
JA = θJC + θCA
(4)
θ
JC is device related and cannot be influenced by the user. However, θCA is user depen-
dent and can be minimized by such thermal management techniques as heat sinks,
ambient air cooling and thermal convection. Thus, good thermal management on the
part of the user can significantly reduce
θ
CA so that θJA approximately equals θJC. Substi-
tution of
θ
JC for θJA in equation (1) will result in a lower semiconductor junction
temperature.
Mechanical and
Environment
The microcircuits shall meet all mechanical environmental requirements of either MIL-
STD-883 for class B devices or DESC devices.
Marking
The document where are defined the marking are identified in the related reference doc-
uments. Each microcircuit are legibly and permanently marked with the following
information as minimum:
•Atmel logo
Manufacturer’s part number
Class B identification
Date-code of inspection lot
ESD identifier if available
Country of manufacturing


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