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IRF6711SPBF Folha de dados(PDF) 3 Page - International Rectifier

Nome de Peças IRF6711SPBF
Descrição Electrónicos  DirectFETPower MOSFET
Download  9 Pages
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Fabricante Electrônico  IRF [International Rectifier]
Página de início  http://www.irf.com
Logo IRF - International Rectifier

IRF6711SPBF Folha de dados(HTML) 3 Page - International Rectifier

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IRF6711SPbF
www.irf.com
3
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 
ˆ Used double sided cooling, mounting pad with large heatsink.
‰ Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
Notes:
Š Rθ is measured at TJ of approximately 90°C.
ƒ Surface mounted on 1 in. square Cu
(still air).
‰ Mounted to a PCB with
small clip heatsink (still air)
‰ Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
10
100
1000
t1 , Rectangular Pulse Duration (sec)
0.001
0.01
0.1
1
10
100
0.20
0.10
D = 0.50
0.02
0.01
0.05
SINGLE PULSE
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
Ri (°C/W)
τi (sec)
5.276
0.00315
30.637
0.75858
22.09
36.9
τ
J
τ
J
τ
1
τ
1
τ
2
τ
2
τ
3
τ
3
R
1
R
1
R
2
R
2
R
3
R
3
Ci=
τi/Ri
Ci=
τi/Ri
τ
A
τ
A
Absolute Maximum Ratings
Parameter
Units
PD @TA = 25°C
Power Dissipation
e
PD @TA = 70°C
Power Dissipation
e
PD @TC = 25°C
Power Dissipation
f
TP
Peak Soldering Temperature
TJ
Operating Junction and
TSTG
Storage Temperature Range
Thermal Resistance
Parameter
Typ.
Max.
Units
RθJA
Junction-to-Ambient
el
–––
58
RθJA
Junction-to-Ambient
jl
12.5
–––
RθJA
Junction-to-Ambient
kl
20
–––
°C/W
RθJC
Junction-to-Case
fl
–––
3.0
RθJ-PCB
Junction-to-PCB Mounted
1.0
–––
Linear Derating Factor
eÃ
W/°C
W
°C
0.017
270
-40 to + 150
Max.
42
2.2
1.4


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