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SI-3011ZF Folha de dados(PDF) 6 Page - Sanken electric |
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SI-3011ZF Folha de dados(HTML) 6 Page - Sanken electric |
6 / 9 page 6 SANKEN ELECTRIC CO., LTD. SI-3011ZF High-Current, Low-Dropout, 1.1 to 5 V Regulator SI-3011ZF Input Capacitor (CI, approximately 10 μF). This is necessary either when the input line includes inductance or when the wiring is long. Output Capacitor (CO , > 47 μF). This device is not designed for a use with a very low ESR output capacitor such as a ceramic capacitor. Output oscillation may occur with that kind of capaci- tor. Output Voltage Adjustable Resistors (R1 and R2). The output voltage is adjusted by R1 and R2. 10 kΩ or 11 kΩ for R2 is recommended. R1 = (VO – Vref ) / (Vref / R2) For an output voltage of 1.8 V or less, add a 10 kΩ resistor between ADJ and the junction of R1 and R2. Determination of DC Input Voltage . The minimum input voltage VI(min) should be higher than the sum of the fixed out- put voltage and the maximum rated dropout voltage. If setting the output voltage lower than 2.0 V, the minimum input voltage should be more than 2.4 V. Overcurrent Protection . The SI-3000ZD series has a built-in fold-back type overcurrent protection circuit, which limits the output current at a start-up mode. It thus cannot be used in appli- cations that require current at the start-up mode such as: (1) constant-current load, (2) power supply with positive and negative outputs to common load (a center-tap type power supply), or (3) raising the output voltage by putting a diode or a resistor between the device ground and system ground. Thermal Protection . Circuitry turns off the pass transistor when the junction temperature rises above 135°C. It is intended only to protect the device from failures due to excessive junction temperatures and should not imply that output short circuits or continuous overloads are permitted. Heat Radiation and Reliability . The reliability of the IC is directly related to the junction temperature (TJ) in its opera- tion. Accordingly, careful consideration should be given to heat dissipation. The graph on page 2 illustrates the effect of thermal resistance on the allowable package power dissipation. The junction temperature (TJ ) can be determined from either of the following equations: TJ = ( PD × RθJA) + TA or TJ = ( PD × RθJC) + TC where PD = IO × (VI – VO) and RθJC = 5 °C/W. Parallel Operation . Parallel operation to increase load current is not permitted. |
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Descrição semelhante - SI-3011ZF |
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