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AMT36VDDF25672Y-26A Folha de dados(PDF) 1 Page - Micron Technology

Nome de Peças AMT36VDDF25672Y-26A
Descrição Electrónicos  DDR SDRAM RDIMM
Download  20 Pages
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Fabricante Electrônico  MICRON [Micron Technology]
Página de início  http://www.micron.com
Logo MICRON - Micron Technology

AMT36VDDF25672Y-26A Folha de dados(HTML) 1 Page - Micron Technology

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Products and specifications discussed herein are subject to change by Micron without notice.
1GB, 2GB (x72, ECC, DR) 184-Pin DDR SDRAM RDIMM
Features
PDF: 09005aef80772fd2/Source: 09005aef8075ebf6
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DDF36C128_256x72.fm - Rev. G 9/08 EN
1
©2002 Micron Technology, Inc. All rights reserved.
DDR SDRAM RDIMM
MT36VDDF12872 – 1GB
MT36VDDF25672 – 2GB
For component data sheets, refer to Micron’s Web site: www.micron.com
Features
• 184-pin, registered dual in-line memory module
(RDIMM)
• Tall- and standard-height PCB options
• Fast data transfer rates: PC2100, PC2700, or PC3200
• 1GB (128 Meg x 72) and 2GB (256 Meg x 72)
• Supports ECC error detection and correction
•VDD = VDDQ = +2.5V
(-40B VDD = VDDQ = +2.6V)
•VDDSPD = +2.3V to +3.6V
• 2.5V I/O (SSTL_2-compatible)
• Internal, pipelined double data rate (DDR)
2n-prefetch architecture
• Bidirectional data strobe (DQS) transmitted/
received with data—that is, source-synchronous
data capture
• Differential clock inputs (CK and CK#)
• Multiple internal device banks for concurrent
operation
•Dual rank
• Selectable burst lengths (BL): 2, 4, or 8
• Auto precharge option
• Auto refresh and self refresh modes: 7.8125µs
maximum average periodic refresh interval
• Serial presence-detect (SPD) with EEPROM
• Selectable CAS latency (CL) for maximum
compatibility
• Gold edge contacts
184-Pin RDIMM Figures
Figure 1:
Tall-Height Layout – 1GB, 2GB
(MO-206-EA)
PCB height: 43.18mm (1.7in)
Figure 2:
Standard-Height Layout – 1GB
(MO-206-CA R/C D)
Figure 3:
Standard-Height Layout – 2GB
(MO-206-CA R/C D)
Notes: 1. Contact Micron for industrial temperature
module offerings.
2. CL = CAS (READ) latency; registered mode
adds one clock cycle to CL.
Options
Marking
• Operating temperature1
– Commercial (0°C ≤ TA ≤ +70°C)
None
– Industrial (–40°C ≤ TA ≤ +85°C)
I
•Package
– 184-pin DIMM (standard)
G
– 184-pin DIMM (Pb-free)
Y
• Memory clock, speed, CAS latency2
– 5.0ns (200 MHz), 400 MT/s, CL = 3
-40B
– 6.0ns (166 MHz), 333 MT/s, CL = 2.5
-335
– 7.5ns (133 MHz), 266 MT/s, CL = 2
-262
– 7.5ns (133 MHz), 266 MT/s, CL = 2
-26A
– 7.5ns (133 MHz), 266 MT/s, CL = 2.5
-265
PCB height: 30.48mm (1.2in)
PCB height: 30.48mm (1.2in)


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