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STP27N3LH5 Folha de dados(PDF) 3 Page - STMicroelectronics |
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STP27N3LH5 Folha de dados(HTML) 3 Page - STMicroelectronics |
3 / 21 page STD27N3LH5, STP27N3LH5, STU27N3LH5 Electrical ratings Doc ID 15617 Rev 3 3/21 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit DPAK, IPAK TO-220 VDS Drain-source voltage (VGS = 0) 30 V VGS Gate-Source voltage ± 22 V ID (1) 1. Limited by wire bonding Drain current (continuous) at TC = 25 °C 27 A ID Drain current (continuous) at TC = 100 °C 19 A IDM (2) 2. Pulse width limited by safe operating area Drain current (pulsed) 108 A PTOT Total dissipation at TC = 25 °C 30 45 W Derating factor 0.2 W/°C EAS (3) 3. Starting TJ = 25 °C, ID = 21 A, L= 0.2 mH Single pulse avalanche energy 50 mJ TJ Tstg Operating junction temperature Storage temperature - 55 to 175 °C Table 3. Thermal resistance Symbol Parameter Value Unit DPAK, IPAK TO-220 RthJC Thermal resistance junction-case max 5 3.33 °C/W RthJA Thermal resistance junction-case max 100 °C/W TJ Maximum lead temperature for soldering purpose 275 °C |
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