3

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FAN2011/FAN2012 Rev. 1.0.4

Absolute Maximum Ratings

Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a

stress rating only and functional operation of the device at these or any other conditions above those indicated in the

operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended

periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless

otherwise specified, all other voltages are referenced to AGND.

Recommended Operating Conditions

Notes:

1. Junction to ambient thermal resistance,

θ

number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat sink

characteristics.

2. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).

3. Refer to the applications section for further details.

Parameter

Min.

Max.

Unit

-0.3

7

V

-0.3

V

Thermal Resistance-Junction to Tab (

θ

(1)

–8

°C/W

Lead Soldering Temperature (10 seconds)

–

260

°C

Storage Temperature

-65

150

°C

Junction Temperature

-40

150

°C

HBM

4

–

kV

CDM

2

–

Parameter

Min.

Typ.

Max.

Unit

Supply Voltage Range

4.5

–

5.5

V

Output Voltage Range, Adjustable Version

0.8

–

V

Output Current

–

–

1500

mA

–

3.3

–

µH

–10–

µF

–4 x 10

–

µF

Operating Ambient Temperature

Range

FAN2011 and FAN2012

0

–

+85

°C

FAN2011I and FAN2012I

-40

–

+85