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Model BD1722N5050AHF

Rev A

Mounting Configuration:

In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be

used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet

published specifications.

All of the Xinger components are constructed from organic PTFE based composites which possess excellent

electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and

ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.

An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the

transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying

pick and place equipment tolerances.

With No DC Bias

With DC Bias

.50

3x .29

.50

Plated thru

hole to

ground

.33

.22

.22

3x Transmission

Line

3x .29

Dimensions are in Millimeters

Mounting Footprint

Solder Resist

Footprint Pad (s)

Circuit Pattern

3x .29

3x .29

.50

.33

.33

.50

3x Transmission

Line

.22

.22

Plated thru

hole to

ground

Dimensions are in Millimeters

Mounting Footprint

Solder Resist

Footprint Pad (s)

Circuit Pattern