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IRF8308MTR1PBF Folha de dados(PDF) 1 Page - International Rectifier

Nome de Peças IRF8308MTR1PBF
Descrição Electrónicos  RoHs Compliant Containing No Lead and Bromide
Download  10 Pages
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Fabricante Electrônico  IRF [International Rectifier]
Página de início  http://www.irf.com
Logo IRF - International Rectifier

IRF8308MTR1PBF Folha de dados(HTML) 1 Page - International Rectifier

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Fig 1. Typical On-Resistance Vs. Gate Voltage
Fig 2. Typical Total Gate Charge vs Gate-to-Source Voltage
 Click on this section to link to the appropriate technical paper.
‚ Click on this section to link to the DirectFET Website.
ƒ Surface mounted on 1 in. square Cu board, steady state.
„ TC measured with thermocouple mounted to top (Drain) of part.
… Repetitive rating; pulse width limited by max. junction temperature.
† Starting TJ = 25°C, L = 0.051mH, RG = 25Ω, IAS = 21A.
Notes:
DirectFET
™ Power MOSFET ‚
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)

Typical values (unless otherwise specified)
l RoHs Compliant Containing No Lead and Bromide

l Low Profile (<0.7 mm)
l Dual Sided Cooling Compatible

l Ultra Low Package Inductance
l Optimized for High Frequency Switching

l Ideal for CPU Core DC-DC Converters
l Optimized for Sync. FET socket of Sync. Buck Converter

l Low Conduction and Switching Losses
l Compatible with existing Surface Mount Techniques

l 100% Rg tested
SQ
SX
ST
MQ
MX
MT
MP
DirectFET
™ ISOMETRIC
MX
Description
The IRF8308MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-
state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries
used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is
followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power
systems, improving previous best thermal resistance by 80%.
The IRF8308MPbF balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching losses.
The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors operating at higher
frequencies. The IRF8308MPbF has been optimized for parameters that are critical in synchronous buck including Rds(on), gate charge and Cdv/dt-
induced turn on immunity. The IRF8308MPbF offers particularly low Rds(on) and high Cdv/dt immunity for synchronous FET applications.
VDSS
VGS
RDS(on)
RDS(on)
30V max ±20V max 1.9mΩ@ 10V 2.7mΩ@ 4.5V
Absolute Maximum Ratings
Parameter
Units
VDS
Drain-to-Source Voltage
V
VGS
Gate-to-Source Voltage
ID @ TA = 25°C
Continuous Drain Current, VGS @ 10V
e
ID @ TA = 70°C
Continuous Drain Current, VGS @ 10V
e
A
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
f
IDM
Pulsed Drain Current
g
EAS
Single Pulse Avalanche Energy
h
mJ
IAR
Avalanche Current
Ãg
A
21
12
Max.
21
150
212
±20
30
27
2.0
4.0
6.0
8.0
10.0
VGS, Gate-to-Source Voltage (V)
0
2
4
6
8
TJ = 25°C
TJ = 125°C
ID = 27A
0
20406080
QG Total Gate Charge (nC)
0
2
4
6
8
10
12
VDS= 24V
VDS= 15V
ID= 21A
Qg tot
Qgd
Qgs2
Qrr
Qoss Vgs(th)
28nC
8.2nC
3.5nC
34nC
20nC
1.8V
IRF8308MPbF
1
www.irf.com © 2014 International Rectifier
Submit Datasheet Feedback
February 24, 2014
Form
Quantity
IRF8308MTRPbF
DirectFET Medium Can
Tape and Reel
4800
"TR" suffix
IRF8308MTR1PbF
DirectFET Medium Can
Tape and Reel
1000
"TR1" suffix EOL notice # 264
Note
Orderable part number
Package Type
Standard Pack


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