LM3686

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SNVS520D – AUGUST 2008 – REVISED MARCH 2011

Absolute Maximum Ratings

(1) (2)

-0.2V to 6.0V

Enable pins,

(GND-0.2V) to

Feedback pins,

SW pin

6.0V max

150°C

Storage Temperature Range

-65°C to + 150°C

Internally Limited

Maximum Lead Temperature

(4)

(Soldering)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

(4)

For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1112: Micro SMD Wafer

Level Chip Scale Package (AN-1112)

Operating Ratings

2.7V to 5.5V

(DC-DC & LDO)

-40°C to + 125°C

-40°C to + 85°C

(1)

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

part/package in the application (

Thermal Properties

Junction-to-Ambient Thermal Resistance (

(1)

Micro SMD 12

120°C/W

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special attention must be paid to thermal dissipation issues in board design.

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