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BA6423AF-E2 Folha de dados(PDF) 8 Page - Rohm

Nome de Peças BA6423AF-E2
Descrição Electrónicos  Standard Single-phase Full wave Fan Motor Driver
Download  13 Pages
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Fabricante Electrônico  ROHM [Rohm]
Página de início  http://www.rohm.com
Logo ROHM - Rohm

BA6423AF-E2 Folha de dados(HTML) 8 Page - Rohm

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BA6423AF
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
19.Jul.2012 Rev.001
TSZ02201-0H1H0B100230-1-2
●Thermal derating curve
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta = 25ºC (normal temperature). IC is
heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable
power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature)
and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to
the maximum value in the storage temperature range.
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which
indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θ
ja [℃/W]. The temperature of IC inside the package can be estimated by this heat resistance. Fig.16 shows the model of
heat resistance of the package.
Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the
equation below:
θja = (Tj - Ta) / P
[℃/W]
Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can
be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance
θja.
Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,
wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at
a specified condition. Fig.17 shows a thermal derating curve (Value when mounting FR4 glass epoxy board 70 [mm] x 70
[mm] x 1.6 [mm] (copper foil area below 3 [%]))
*Reduce by 6.24 mW/℃ over 25℃.
(On 70.0mm×70.0mm×1.6mm glass epoxy board)
Fig.17 Thermal derating curve
θja = (Tj - Ta) / P
[℃/W]
Fig.16 Thermal resistance
Ambient temperature Ta[℃]
Chip surface temperature Tj[℃]
Power consumption P[W]
400
600
800
1000
Pd(mW
)
0
25
50
75
100
125
150
Ta(℃)
200
780


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