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BA6423AF-E2 Folha de dados(PDF) 8 Page - Rohm |
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BA6423AF-E2 Folha de dados(HTML) 8 Page - Rohm |
8 / 13 page Datasheet 8/10 BA6423AF © 2012 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111・15・001 19.Jul.2012 Rev.001 TSZ02201-0H1H0B100230-1-2 ● ● ● ●Thermal derating curve Power dissipation (total loss) indicates the power that can be consumed by IC at Ta = 25ºC (normal temperature). IC is heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θ ja [℃/W]. The temperature of IC inside the package can be estimated by this heat resistance. Fig.16 shows the model of heat resistance of the package. Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the equation below: θja = (Tj - Ta) / P [℃/W] Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at a specified condition. Fig.17 shows a thermal derating curve (Value when mounting FR4 glass epoxy board 70 [mm] x 70 [mm] x 1.6 [mm] (copper foil area below 3 [%])) *Reduce by 6.24 mW/℃ over 25℃. (On 70.0mm×70.0mm×1.6mm glass epoxy board) Fig.17 Thermal derating curve θja = (Tj - Ta) / P [℃/W] Fig.16 Thermal resistance Ambient temperature Ta[℃] Chip surface temperature Tj[℃] Power consumption P[W] 400 600 800 1000 Pd(mW ) 0 25 50 75 100 125 150 Ta(℃) 200 780 |
Nº de peça semelhante - BA6423AF-E2 |
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Descrição semelhante - BA6423AF-E2 |
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