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AM55-0004RTR Folha de dados(PDF) 6 Page - Tyco Electronics

Nome de Peças AM55-0004RTR
Descrição Electrónicos  250 mW Linear Power Amplifier and T/R Switch 1.8 - 2.0 GHz
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Fabricante Electrônico  MACOM [Tyco Electronics]
Página de início  http://www.macom.com
Logo MACOM - Tyco Electronics

AM55-0004RTR Folha de dados(HTML) 6 Page - Tyco Electronics

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External Circuitry
Label
Value
Purpose
C1 - C5
1000 pF
Low frequency bypass
C6 - C8
68 pF
RF bypass
C9
1.5 pF
Output power tuning
C10
15 pF
Reduces low frequency gain
R1
2.7 k
Voltage divider to V
G2
R2
1.5 k
Voltage divider to V
G2
R3
150
Reduces low frequency gain
Tline
0.250 in. long
Power match
250 mW Linear Power Amplifier and T/R Switch
AM55-0004
Specifications Subject to Change Without Notice
V 2.00
M/A-COM Inc.
s
1011 Pawtucket Boulevard, Lowell, MA 01853 USA
s
Telephone: 800-366-2266
6
Recommended PCB Configuration
Layout View
Cross-Section View
External Circuitry Parts List
All off-chip components are low-cost surface mount components obtainable from
multiple sources. (0.020 in. x 0.040 in. or 0.030 in. x 0.050 in.)
V
DD1
C8
C5
VSW
Tx IN
Rx OUT
ANT IN/OUT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
C4
Save Tx
VSW
R2
R1
C1
C6
VDD2
V
G2
VG1
C9
PA OUT
C10
C2
PA IN
C3
C7
R3
TLine
The PCB dielectric between RF traces and RF ground layers
should be chosen to reduce RF discontinuities between
50-
Ω lines and package pins. M/A-COM recommends an
FR-4 dielectric thickness of 0.008 in. (0.2 mm), yielding a
50-
Ω line width of 0.015 in. (0.38 mm). The recommended
metalization thickness is 1 oz. copper.
Shaded traces are vias to DC routing layer and traces on DC
routing layer.
Biasing Procedure
The AM55-0004 requires that V
GG bias be applied prior to
any
V
DD bias. Permanent damage may occur if this
procedure is not followed. All FETs in the PA will draw
excessive current and damage internal circuitry.
RF Traces + Components
RF Ground
DC Routing
Customer Defined
C1
C6
C9
C2
C10
C7
R2
R1
R3
C3
C4
C5
C8
0.700 in.
0.490 in.
Pin 1


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