NXP Semiconductors

BYC8X-600P

Hyperfast power diode

BYC8X-600P

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Product data sheet

3 August 2015

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9. Thermal characteristics

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

without heatsink compound

-

-

7.2

K/W

thermal resistance

from junction to

heatsink

with heatsink compound; Fig. 5

-

-

5.5

K/W

thermal resistance

from junction to

ambient free air

-

60

-

K/W

001aaf257

1

10

(K/W)

10

1

T

P

t

T

δ =

Fig. 5. Transient thermal impedance from junction to heatsink as a function of pulse width

10. Isolation characteristics

Table 7.

Isolation characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

RMS isolation voltage 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; from all

pins to external heatsink; sinusoidal

waveform; clean and dust free

-

-

2500

V

isolation capacitance

from cathode to external heatsink

-

10

-

pF