LM3478, LM3478Q-Q1

SNVS085W – JULY 2000 – REVISED DECEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input Voltage

45

V

FB Pin Voltage

–0.4< V

V

FA/SD Pin Voltage

V

Peak Driver Output Current

1

A

(<10µs)

Power Dissipation

Internally Limited

Junction Temperature

+150

°C

Lead Temperature

Vapor Phase (60 s)

215

°C

Infrared (15 s)

260

°C

DR Pin Voltage

–0.4

≤ VDR

VDR

≤ 8

V

500

mV

Storage temperature

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings - LM3478

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 ESD Ratings - LM3478Q-Q1

VALUE

UNIT

±2000

Electrostatic discharge

Other pins

±750

V

Charged device model (CDM), per

AEC Q100-011

Corner pins (1, 4, 5, and 8)

±750

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply Voltage

2.97

V

Junction Temperature Range

°C

Switching Frequency

100

MHz

4

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