Diode

temp.

sensor

Σ

ADC

Oscillator

Control

logic

Serial

interface

Config.

and temp.

register

TMP112-Q1

Temperature

SCL

1

3

6

4

ALERT

SDA

GND

2

5

V+

ADD0

TMP112-Q1

SLOS887D – SEPTEMBER 2014 – REVISED DECEMBER 2015

www.ti.com

7 Detailed Description

7.1 Overview

The TMP112-Q1 device is a digital temperature sensor that is optimal for thermal-management and thermal-

specified over an operating temperature range of –40°C to 125°C. Figure 8 shows a block diagram of the

TMP112-Q1 device. Figure 9 illustrates the ESD protection circuitry contained in the TMP112-Q1 device.

The temperature sensor in the TMP112-Q1 device is the chip itself. Thermal paths run through the package

leads as well as the plastic package. The package leads provide the primary thermal path because of the lower

thermal resistance of the metal.

An alternative version of the TMP112-Q1 device is available. The TMP102-Q1 device has reduced accuracy, the

same micro-package, and is pin-to-pin compatible.

Table 1. Advantages of TMP112-Q1 Versus TMP102-Q1

Supply

Supply

Specified

Compatible

Supply

Local Sensor Accuracy

Device

Package

Voltage

Voltage

Resolution

Calibration

Interfaces

Current

(Max)

(Min)

(Max)

Drift Slope

SOT563

12 Bit

0.5°C: (0°C to 65°C)

TMP112-Q1

10µA

1.4V

3.6V

Yes

1.2 × 1.6 × 0.6

0.0625°C

1°C: (-40°C to 125°C)

SMBus

SOT563

12 Bit

2°C: (25°C to 85°C)

TMP102-Q1

10µA

1.4V

3.6V

No

1.2 × 1.6 × 0.6

0.0625°C

3°C: (-40°C to 125°C)

SMBus

7.2 Functional Block Diagram

Figure 8. Internal Block Diagram

8

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