TMP302-Q1

TRIPSET0

TRIPSET1

HYSTSET

GND

OUT

0.1 µF

OUTPUT

1.4 V to 3.6 V

10 k

TMP302-Q1

www.ti.com

SLOS889B – OCTOBER 2014 – REVISED JULY 2015

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

9.1.1 Configuring the TMP302-Q1

The TMP302-Q1 family of devices is simple to configure. The only external components that the device requires

are a bypass capacitor and pullup resistor. Power-supply bypassing is strongly recommended. Use a 0.1-µF

capacitor placed as close as possible to the supply pin. To minimize the internal power dissipation of the

TMP302-Q1 family of devices, use a pullup resistor value greater than 10 k

Refer to Table 1 for trip-point temperature configuration. The TRIPSET pins can be toggled dynamically;

9.2 Typical Application

Figure 10 shows the typical circuit configuration for the TMP302-Q1 family of devices. The TMP302-Q1 family of

devices is configured for the default temperature threshold by connecting the TRIPSET0 and TRIPSET1 pins

directly to ground. Connecting the HYSTSET pin to ground configures the device for 5°C of hysteresis. Place a

10-k

ground, close to the TMP302-Q1 device.

Figure 10. TMP302-Q1 Typical Application Schematic

Figure 11 shows the most generic implementation of the TMP302-Q1 family of devices. Switches are shown

strictly required; the switches are shown only to illustrate the various pin connection combinations. In practice,

minimizes space and cost. If additional flexibility is desired, connections from the TMPSET0, TMPSET1 and

HYSTSET pins can be made through 0-

Ω resistors which can be either populated or not populated depending

upon the desired connection.

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