SM74101

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SNOSBA2B – JULY 2011 – REVISED MAY 2015

Thermal Considerations (continued)

(3)

We know that the junction temperature is given by

(4)

Or the rise in temperature is given by

(5)

For WSON-6 package, the integrated circuit die is attached to leadframe die pad which is soldered directly to the

printed circuit board. This substantially decreases the junction to ambient thermal resistance (

suitable means of heat dispersion from the IC to the ambient through exposed copper pad, which can readily

dissipate heat to the surroundings,

for the driver example above is thereby reduced to just 5.5 degrees.

(6)

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