LC898121XA

www.onsemi.com

3

Package Dimensions

unit : mm

WLCSP40, 2.44x3.94

CASE 567JB

ISSUE O

SEATING

PLANE

0.10 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X

DIM

A

MIN

MAX

−−−

MILLIMETERS

A1

D

2.44 BSC

E

b

0.22

0.32

e

0.50 BSC

0.65

D

E

A

B

PIN A1

REFERENCE

e

A

0.05

B

C

0.03 C

0.08 C

40X

b

45

6

C

B

A

0.10 C

A1

C

0.15

0.24

3.94 BSC

0.25

40X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50

0.10 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

RECOMMENDED

A1

PACKAGE

OUTLINE

8

7

3

2

1

PITCH

E

D

0.50

PITCH

A

e/2

e