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UA741CDRG4 Folha de dados(PDF) 10 Page - Texas Instruments

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Nome de Peças UA741CDRG4
Descrição Electrónicos  General-Purpose Operational Amplifiers
Download  28 Pages
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
Logo TI1 - Texas Instruments

UA741CDRG4 Folha de dados(HTML) 10 Page - Texas Instruments

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BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C.
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
+
OUT
IN +
IN –
VCC+
(7)
(3)
(2)
(6)
(4)
VCC –
(5)
(1)
OFFSET N2
OFFSET N1
45
36
(1)
(8)
(7)
(6)
(5)
(4)
(3)
(2)
uA741
SLOS094E – NOVEMBER 1970 – REVISED JANUARY 2015
www.ti.com
8.3 Feature Description
8.3.1 Offset-Voltage Null Capability
The input offset voltage of operational amplifiers (op amps) arises from unavoidable mismatches in the
differential input stage of the op-amp circuit caused by mismatched transistor pairs, collector currents, current-
gain betas (
β), collector or emitter resistors, etc. The input offset pins allow the designer to adjust for these
mismatches by external circuitry. See the Application and Implementation section for more details on design
techniques.
8.3.2 Slew Rate
The slew rate is the rate at which an operational amplifier can change its output when there is a change on the
input. The µA741 has a 0.5-V/
μs slew rate. Parameters that vary significantly with operating voltages or
temperature are shown in the Typical Characteristics graphs.
8.4 Device Functional Modes
The µA741 is powered on when the supply is connected. It can be operated as a single supply operational
amplifier or dual supply amplifier depending on the application.
8.5 µA741Y Chip Information
This chip, when properly assembled, displays characteristics similar to the µA741C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
10
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Copyright © 1970–2015, Texas Instruments Incorporated
Product Folder Links: uA741


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