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LM4040AIM3X-4.1 Folha de dados(PDF) 5 Page - Texas Instruments

Nome de Peças LM4040AIM3X-4.1
Descrição Electrónicos  Precision Micropower Shunt Voltage Reference
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
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LM4040AIM3X-4.1 Folha de dados(HTML) 5 Page - Texas Instruments

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LM4040-N, LM4040-N-Q1
www.ti.com
SNOS633J – OCTOBER 2000 – REVISED AUGUST 2015
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Reverse Current
20
mA
Forward Current
10
mA
SOT-23 (M3) Package
306
mW
Power Dissipation (TA =
TO-92 (Z) Package
550
mW
25°C)(3)
SC70 (M7) Package
241
mW
SOT-23 (M3) Package Peak Reflow (30 sec)
260
°C
Soldering Temperature(4)
TO-92 (Z) Package Soldering (10 sec)
260
°C
SC70 (M7) Package Peak Reflow (30 sec)
260
°C
Storage Temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
RθJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax − TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4040-N,
TJmax = 125°C, and the typical thermal resistance (RθJA), when board mounted, is 326°C/W for the SOT-23 package, and 180°C/W with
0.4
″ lead length and 170°C/W with 0.125″ lead length for the TO-92 package and 415°C/W for the SC70 Package.
(4)
For definitions of Peak Reflow Temperatures for Surface Mount devices, see the TI Absolute Maximum Ratings for Soldering Application
Report (SNOA549).
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±200
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Copyright © 2000–2015, Texas Instruments Incorporated
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