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LM4040AIM3X-4.1 Folha de dados(PDF) 5 Page - Texas Instruments |
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LM4040AIM3X-4.1 Folha de dados(HTML) 5 Page - Texas Instruments |
5 / 67 page LM4040-N, LM4040-N-Q1 www.ti.com SNOS633J – OCTOBER 2000 – REVISED AUGUST 2015 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Reverse Current 20 mA Forward Current 10 mA SOT-23 (M3) Package 306 mW Power Dissipation (TA = TO-92 (Z) Package 550 mW 25°C)(3) SC70 (M7) Package 241 mW SOT-23 (M3) Package Peak Reflow (30 sec) 260 °C Soldering Temperature(4) TO-92 (Z) Package Soldering (10 sec) 260 °C SC70 (M7) Package Peak Reflow (30 sec) 260 °C Storage Temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), RθJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax − TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4040-N, TJmax = 125°C, and the typical thermal resistance (RθJA), when board mounted, is 326°C/W for the SOT-23 package, and 180°C/W with 0.4 ″ lead length and 170°C/W with 0.125″ lead length for the TO-92 package and 415°C/W for the SC70 Package. (4) For definitions of Peak Reflow Temperatures for Surface Mount devices, see the TI Absolute Maximum Ratings for Soldering Application Report (SNOA549). 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±200 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Copyright © 2000–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM4040-N LM4040-N-Q1 |
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Descrição semelhante - LM4040AIM3X-4.1 |
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