TPA6130A2

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SLOS488F – NOVEMBER 2006 – REVISED MARCH 2015

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

6.0

V

RIGHTINx, LEFTINx

–2.5

3.6

V

Input voltage

SD, SCL, SDA

–0.3

7

V

Output continuous total power dissipation

See the Thermal Information table

Operating free-air temperature range

–40

85

°C

Operating junction temperature range

–40

150

°C

Minimum Load Impedance

12.8

12.8

Ω

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,

–8

8

kV

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

Electrostatic discharge

–3.5

3.5

kV

Charged device model (CDM), per JEDEC specification

–1500

1500

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

2.5

5.5

V

High-level input voltage

SCL, SDA, SD

1.3

V

SCL, SDA

0.6

V

Low-level input voltage

SD

0.35

V

7.4 Thermal Information

RTJ

YZH

UNIT

20 PINS

16 PINS

Junction-to-ambient thermal resistance

34.8

75

Junction-to-case (top) thermal resistance

32.5

22

Junction-to-board thermal resistance

11.6

26

°C/W

Junction-to-top characterization parameter

0.4

0.2

Junction-to-board characterization parameter

11.6

24

Junction-to-case (bottom) thermal resistance

3.1

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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