Si52112-B5/B6

6

Rev 1.2

Spread Range

Down Spread, -B6 only

—

–0.5

—

%

Modulation Frequency

-B6 only

30

31.5

33

kHz

Enable/Disable and Set-up

Clock Stabilization from Power-

up

——

3

ms

Stopclock Set-up Time

10.0

—

—

ns

Table 4. Thermal Conditions

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Temperature, Storage

Non-functional

–65

—

150

°C

Temperature, Operating Ambient

Functional

–40

—

85

°C

Temperature, Junction

Functional

—

—

150

°C

Dissipation, Junction to Case (TDFN)

JEDEC (JESD 51)

—

—

38.3

°C/W

Dissipation, Junction to Case (TSSOP)

JEDEC (JESD 51)

—

—

37.0

°C/W

Dissipation, Junction to Ambient (TDFN)

JEDEC (JESD 51)

—

—

90.4

°C/W

Dissipation, Junction to Ambient (TSSOP)

JEDEC (JESD 51)

—

—

124.0 °C/W

Table 5. Absolute Maximum Conditions

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Main Supply Voltage

——

4.6

V

Input Voltage

–0.5

—

4.6

ESD Protection (Human Body Model)

JEDEC (JESD 22 - A114)

2000

—

—

V

Flammability Rating

UL-94

UL (Class)

V–0

Note:

While using multiple power supplies, the voltage on any input or I/O pin cannot exceed the power pin during powerup. Power

Table 3. AC Electrical Specifications (Continued)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Notes:

1.

2.

Gen 4 specifications based on the PCI-Express Base Specification 4.0 rev. 0.5.

3.