GND

= VIA to GND

IO2

IO1

0

20

40

60

80

100

120

140

160

180

0

1

2

3

4

5

0

10

20

30

40

50

Time (µs)

Current (A)

Power (W)

C014

8

TPD2E007

SLVS796H – SEPTEMBER 2008 – REVISED JANUARY 2016

www.ti.com

Product Folder Links: TPD2E007

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Copyright © 2008–2016, Texas Instruments Incorporated

8.2.3 Application Curve

Figure 7. Surge Pulse Waveform

9 Power Supply Recommendations

This device is a passive ESD device so there is no need to power it. Take care not to violate the recommended

I/O specification (±13 V) to ensure the device functions properly.

10 Layout

10.1 Layout Guidelines

•

The optimum placement is as close to the connector as possible.

–

EMI during an ESD event can couple from the trace being struck to other nearby unprotected traces,

resulting in early system failures.

–

The PCB designer needs to minimize the possibility of EMI coupling by keeping any unprotected traces

away from the protected traces which are between the TVS and the connector.

•

Route the protected traces as straight as possible.

•

Eliminate any sharp corners on the protected traces between the TVS and the connector by using rounded

corners with the largest radii possible.

–

Electric fields tend to build up on corners, increasing EMI coupling.

10.2 Layout Example

Figure 8. Layout Recommendation