TS12001

Final Datasheet

Rev 1.3

April 30, 2015

www.semtech.com

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Functional Description (continued)

Application Using A Multi-Layer PCB

To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed

when laying out this part on the PCB.

The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane.

Package Thermal Pad

Solder Pad (Land Pattern)

Thermal Via's

Package Outline

Package and PCB Land Configuration

For a Multi-Layer PCB

JEDEC standard FR4 PCB Cross-section:

(square)

Package Solder Pad

Package Solder Pad

(bottom trace)

Thermal Via

Component Traces

Thermal Isolation

Power plane only

1.5748mm

0.0 - 0.071 mm Board Base

& Bottom Pad

0.5246 - 0.5606 mm

Power Plane

(1oz Cu)

1.0142 - 1.0502 mm

Ground Plane

(1oz Cu)

1.5038 - 1.5748 mm

Component Trace

(2oz Cu)

2 Plane

4 Plane

Multi-Layer Board (Cross-sectional View)

In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to

the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias,

thickness of copper, etc.