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KA-430 Folha de dados(PDF) 3 Page - Protek Devices |
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KA-430 Folha de dados(HTML) 3 Page - Protek Devices |
3 / 6 page Only One Name Means ProTek’Tion™ www.protekdevices.com 05459.R4 12/15 Page 3 K SERIES TYPICAL DEVICE CHARACTERISTICS TABLE 1 - STANDARD PACKAGE , LEADED PROCESS, PACKAGE PEAK REFLOW TEMPERATURE Package Thickness Volume mm3 < 350 Volume mm3 >= 350 < 2.5mm 240 +0/-5°C 225 +0/-5°C >= 2.5mm 225 +0/-5°C 225 +0/-5°C NOTES: 1. The package thickness and volume dictates the maximum component temperature. The thermal gradients between packages can be reduced by using convection reflow processes. 2. Volume of the package does not account for the external terminals. 3. Package volume is the equivalent of package size multipled by the height. TABLE 2 - LEAD-FREE PROCESS, PACKAGE PEAK REFLOW TEMPERATURE Package Thickness Volume mm3 < 350 Volume mm3 250 - 2000 Volume mm3 > 2000 < 1.6mm 260 +0°C 260 +0°C 260 +0°C 1.6mm - 2.5mm 260 +0°C 250 +0°C 245 +0°C >= 2.5mm 250 +0°C 245 +0°C 245 +0°C NOTES: 1. The profiling tolerance is +0, -X °C but at no time will it exceed -5°C. 2. Volume of the package does not account for the external terminals. 3. The package thickness and volume dictates the maximum component temperature. The thermal gradients between packages can be reduced by using convection reflow processes. 4. Components used in lead-free assembly shall be evaluated using the lead-free classification temperature and profiles as defined in the above table. 5. Table 3 will help determine if the components are lead-free or not. 6. The device manufacturer/supplier shall ensure process compatibility up to and including the stated classification temperature at the rated MSL level. TABLE 3 - CLASSIFICATION REFLOW PROFILES Profile Feature Sn - Pb Eutetectic Assembly Pb-Free Assembly Average Ramp Up Rate (T SMAX to TP) 3°C/seconds Max. 3°C/seconds Max. Preheat Temperature Min T SMIN Temperature MAX T SMAX Time (T SMIN to TSMAX) (ts) 100°C 150°C 60-120 seonds 150°C 200°C 60-180 seconds Time Maintained Above Temperature (T L) Time(t L) 183°C 60-150 seconds 217°C 60-150 seconds Peak/Classification Temperature (T P) See Table 1 See Table 2 Time Within 5°C of Actual Temperature (t P) 10-30 seconds 20-40 seconds Ramp-Down Rate 6°C/seconds Max. 6°C/seconds Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. NOTES: 1. All temperatures refer to topside of the package, measured on the package body surface. 2. Time within 5°C of the actual peak temperature (T P) specified for the reflow profiles is “supplier” minimum and “user” maximum. |
Nº de peça semelhante - KA-430 |
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Descrição semelhante - KA-430 |
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