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LM2936Q Folha de dados(PDF) 4 Page - Texas Instruments |
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LM2936Q Folha de dados(HTML) 4 Page - Texas Instruments |
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4 / 30 page  4 LM2936Q SNVS684D – NOVEMBER 2010 – REVISED MARCH 2016 www.ti.com Product Folder Links: LM2936Q Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications. (3) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) − TA) / RθJA. If this dissipation is exceeded, the die temperature can rise above the TJ(MAX) of 150°C, and the LM2936Q may go into thermal shutdown. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Input voltage (survival) −50 60 V Power dissipation(3) Internally limited Junction temperature, TJMAX 150 °C Storage temperature, Tstg −65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. . 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V 6.3 Recommended Operating Conditions MIN MAX UNIT Temperature, TJ −40 125 °C Input voltage, VIN (LM2936Q) 5.5 40 V Input voltage, VIN (LM2936QH only) 5.5 60 V Shutdown pin voltage, VSD (LM2936QHBMA only) 0 40 V (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) Thermal resistance value R θJA is based on the EIA/JEDEC High-K printed circuit board defined by: JESD51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages. 6.4 Thermal Information THERMAL METRIC(1) LM2936Q UNIT SOIC (D) TO-252 (NDP) VSSOP (DGK) SOT-223 (DCY) 8 PINS 3 PINS 8 PINS 4 PINS RθJA (2) Junction-to-ambient thermal resistance, High-K 111.4 50.5 173.4 62.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 56.3 52.6 65.9 44.2 °C/W RθJB Junction-to-board thermal resistance 51.9 29.7 94.9 11.7 °C/W ψJT Junction-to-top characterization parameter 10.9 4.8 9.6 3.6 °C/W ψJB Junction-to-board characterization parameter 51.4 29.3 93.3 11.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 1.6 n/a n/a °C/W |
Nº de peça semelhante - LM2936Q_16 |
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Descrição semelhante - LM2936Q_16 |
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