LM285DRG4-2-5 datasheet(4/25 Pages) TI1

Nome de Peças	LM285DRG4-2-5

Descrição Electrónicos	Micropower Voltage References

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Fabricante Electrônico	TI1 [Texas Instruments]

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4

LM285-2.5, LM385-2.5, LM385B-2.5

SLVS023K – JANUARY 1989 – REVISED MARCH 2016

www.ti.com

Product Folder Links: LM285-2.5 LM385-2.5 LM385B-2.5

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

IR

Reverse current

30

mA

IF

Forward current

10

mA

Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds

260

°C

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

IZ

Reference current

0.02

20

mA

TA

Operating free-air temperature

LM285-2.5

–40

85

°C

LM385-2.5, LM385B-2.5

0

70

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LMx85-2.5, LM385B-2.5

UNIT

D (SOIC)

LP (T0-92)

PW (TSSOP)

8 PINS

3 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

112

157

168.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

58.5

80.3

53.7

°C/W

RθJB

Junction-to-board thermal resistance

52.1

N/A

96.4

°C/W

ψJT

Junction-to-top characterization parameter

15.8

24.6

4.5

°C/W

ψJB

Junction-to-board characterization parameter

51.7

136.2

94.7

°C/W

Nº de peça semelhante - LM285DRG4-2-5

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