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LM27761DSGR Folha de dados(PDF) 4 Page - Texas Instruments |
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LM27761DSGR Folha de dados(HTML) 4 Page - Texas Instruments |
4 / 29 page 4 LM27761 SNVSA85B – OCTOBER 2015 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: LM27761 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications. (3) The maximum power dissipation must be de-rated at elevated temperatures and is limited by TJMAX (maximum junction temperature), TA (ambient temperature) and RθJA (junction-to-ambient thermal resistance). The maximum power dissipation at any temperature is: PDissMAX = (TJMAX – TA)/RθJA up to the value listed in the Absolute Maximum Ratings. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Ground voltage, VIN to GND or GND to VOUT 5.8 V EN (GND − 0.3 V) (VIN + 0.3 V) Continuous output current, CPOUT and VOUT 300 mA TJMAX (3) 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Operating ambient temperature, TA –40 85 °C Operating junction temperature, TJ –40 125 °C Operating input voltage, VIN 2.7 5.5 V Operating output current, IOUT 0 250 mA (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report SPRA953. 6.4 Thermal Information THERMAL METRIC(1) LM27761 UNIT WSON (DSG) 8 PINS RθJA Junction-to-ambient thermal resistance 67.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 89.9 °C/W RθJB Junction-to-board thermal resistance 37.6 °C/W ψJT Junction-to-top characterization parameter 2.4 °C/W ψJB Junction-to-board characterization parameter 38 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 9.4 °C/W |
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