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LM27761

SNVSA85B – OCTOBER 2015 – REVISED FEBRUARY 2016

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under . Exposure to

absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.

(3)

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Ground voltage, VIN to GND or GND to VOUT

5.8

V

EN

(GND

− 0.3 V)

Continuous output current, CPOUT and VOUT

300

mA

(3)

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±1000

V

±250

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

–40

85

°C

–40

125

°C

2.7

5.5

V

0

250

mA

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report SPRA953.

6.4 Thermal Information

LM27761

UNIT

WSON (DSG)

8 PINS

Junction-to-ambient thermal resistance

67.7

°C/W

Junction-to-case (top) thermal resistance

89.9

°C/W

Junction-to-board thermal resistance

37.6

°C/W

Junction-to-top characterization parameter

2.4

°C/W

Junction-to-board characterization parameter

38

°C/W

Junction-to-case (bottom) thermal resistance

9.4

°C/W