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LM3444 Folha de dados(PDF) 5 Page - Texas Instruments |
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LM3444 Folha de dados(HTML) 5 Page - Texas Instruments |
5 / 27 page LM3444 www.ti.com SNVS682D – NOVEMBER 2010 – REVISED DECEMBER 2015 6.5 Electrical Characteristics All typical limits are for TJ = 25°C and all maximum and minimum limits apply over the full operating temperature range (TJ = −40°C to 125°C). Minimum and maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VCC = 12 V. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VCC SUPPLY IVCC Operating supply current 1.58 2.25 mA Rising threshold 7.4 7.7 VCC-UVLO Falling threshold 6 6.4 V Hysterisis 1 COFF VCOFF Time-out threshold 1.225 1.276 1.327 V RCOFF Off timer sinking impedance 33 60 Ω tCOFF Restart timer 180 µs CURRENT LIMIT VISNS ISNS limit threshold 1.174 1.269 1.364 V Leading edge blanking time 125 ns tISNS Current limit reset delay 180 µs ISNS limit to GATE delay ISNS = 0 to 1.75-V step 33 ns CURRENT SENSE COMPARATOR VFILTER FILTER open circuit voltage 720 750 780 mV RFILTER FILTER impedance 1.12 M Ω VOS Current sense comparator offset voltage –4 0.1 4 mV GATE DRIVE OUTPUT VDRVH GATE high saturation IGATE = 50 mA 0.24 0.5 V VDRVL GATE low saturation IGATE = 100 mA 0.22 0.5 Peak souce current GATE = VCC/2 –0.77 IDRV A Peak sink current GATE = VCC/2 0.88 Rise time Cload = 1 nF 15 tDV ns Fall time Cload = 1 nF 15 THERMAL SHUTDOWN Thermal shutdown temperature 165 TSD See (1) °C Thermal shutdown hysteresis 20 (1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). Copyright © 2010–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM3444 |
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