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LM2651MTC-3.3 Folha de dados(PDF) 4 Page - Texas Instruments |
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LM2651MTC-3.3 Folha de dados(HTML) 4 Page - Texas Instruments |
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4 / 23 page  LM2651 SNVS032E – FEBRUARY 2000 – REVISED JANUARY 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Input voltage 15 V Feedback pin voltage −0.4 5 V Power dissipation (TA = 25°C) (3) 893 mW Junction temperature, TJ −40 125 °C Storage temperature, Tstg −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (3) The maximum allowable power dissipation is calculated by using PDmax = (TJmax – TA) / θJA , where TJmax is the maximum junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance of the specified package. The 893- mW rating results from using 150°C, 25°C, and 140°C/W for TJmax, TA, and θJA respectively. A θJA of 140°C/W represents the worst- case condition of no heat sinking of the 16-pin TSSOP package. Heat sinking allows the safe dissipation of more power. The absolute maximum power dissipation must be derated by 7.1 4 mW per °C above 25°C ambient. The LM2651 actively limits its junction temperature to about 165°C. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Supply voltage 4 14 V 6.4 Thermal Information LM2651 THERMAL METRIC(1) PW (TSSOP) UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 97.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 29.9 °C/W RθJB Junction-to-board thermal resistance 43.1 °C/W ψJT Junction-to-top characterization parameter 1.8 °C/W ψJB Junction-to-board characterization parameter 42.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM2651 |
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