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CSD16401Q5 Folha de dados(PDF) 1 Page - Texas Instruments

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Nome de Peças CSD16401Q5
Descrição Electrónicos  25V N-Channel NexFET Power MOSFET
Download  13 Pages
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
Logo TI1 - Texas Instruments

CSD16401Q5 Folha de dados(HTML) 1 Page - Texas Instruments

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VGS - Gate-to-Source Voltage (V)
0
2
4
6
8
10
12
0
1
2
3
4
5
6
D007
TC = 25°C, I D = 40 A
TC = 125°C, I D = 40 A
Qg - Gate Charge (nC)
0
10
20
30
40
50
60
0
2
4
6
8
10
12
D004
ID = 40 A
VDS = 12.5 V
1
D
2
D
3
D
4
D
D
5
G
6
S
7
S
8
S
P0094-01
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
Reference
Design
CSD16401Q5
SLPS200B – AUGUST 2009 – REVISED SEPTEMBER 2015
CSD16401Q5 25-V N-Channel NexFET™ Power MOSFET
1 Features
Product Summary
1
Ultralow Qg and Qgd
TA = 25°C
VALUE
UNIT
Low Thermal Resistance
VDS
Drain-to-Source voltage
25
V
Avalanche Rated
Qg
Gate Charge, Total (4.5 V)
21
nC
Qgd
Gate Charge, Gate-to-Drain
5.2
nC
SON 5-mm × 6-mm Plastic Package
VGS = 4.5 V
1.8
m
Drain-to-Source
RDS(on)
On Resistance
2 Applications
VGS = 10 V
1.3
m
VGS(th)
Threshold Voltage
1.5
V
Point-of-Load Synchronous Buck Converter for
Applications in Networking, Telecom and
Device Information(1)
Computing Systems
DEVICE
PACKAGE
MEDIA
QTY
SHIP
Optimized for Synchronous FET Applications
SON
13-inch
Tape and
CSD16401Q5
5 mm × 6 mm
2500
Reel
Reel
3 Description
Plastic Package
This 25-V, 1.3-m
Ω, 5-mm × 6-mm SON NexFET™
(1) For all available packages, see the orderable addendum at
power MOSFET has been designed to minimize
the end of the data sheet.
losses in power conversion applications.
Absolute Maximum Ratings
Top View
TA = 25°C
VALUE
UNIT
VDS
Drain-to-Source Voltage
25
V
VGS
Gate-to-Source Voltage
–12 to 16
V
Continuous Drain Current (Package
100
Limited)
ID
Continuous Drain Current (Silicon
A
261
Limited), TC = 25°C
Continuous Drain Current(1)
38
IDM
Pulsed Drain Current, TA = 25°C
(2)
240
A
Power Dissipation(1)
3.1
PD
W
Power Dissipation, , TC = 25°C
156
TJ,
Operating Junction and
–55 to 150
°C
Tstg
Storage Temperature
Added text for spacing
Avalanche Energy, Single Pulse
EAS
500
mJ
ID = 100 A, L = 0.1 mH, RG = 25 Ω
Added text for spacing
(1)
RθJA = 40°C/W on 1-in
2 (6.45-cm2) Cu [2 oz. (0.071-mm
Added text for spacing
thick)] on 0.060-inch (1.52-mm) thick FR4 PCB.
(2)
Max RθJC = 0.8°C/W, pulse duration ≤100 μs, duty cycle ≤1%
RDS(ON) vs VGS
Gate Charge
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.


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